The circuit part and the thermal layer part of the substrate are on different circuit layers, and the thermal layer part directly contacts the heat dissipation part of the lamp bead to achieve the best heat dissipation (zero thermal resistance) effect. And the material of the substrate is generally the copper substrate.  

Flexible circuits are consist of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits. It is now one of the most important interconnection technologies in use for the manufacture of many of today's most advanced electronic products.
APOLLOPCB creates both flexible and printed circuit boards for product manufacturers. 

Specialized in the advanced PCB, APOLLOPCB has fully updated the production equipments and fabricate your printed circuit board with the advanced technologies. What’s more, APOLLOPCB offers mature and high-class quick turn PCB fabrication and assembly, supported by its three PCB factories covering 17,000 square meters totally.

MCPCB, a metal-based PCB, is comprised of a metal substrate (ie Aluminum, Copper or Stainless Steel ect.,), thermal dissipating dielectric and the copper circuit. Due to its superior heat dissipation, MPCBs are used for a wide array of applications. You can find them in power supplies, LED lighting or anywhere that heat is a major factor. 

ApolloPCB provides SMT placement processing services for mid-to-high-end customers. The company is equipped with 9 fully automatic high-speed SMT patch production lines, fully-automatic board loading machines, fully-automatic solder paste printers, SPI solder paste thickness detectors, multi-temperature zone reflow soldering, AOI optical inspection equipment, X-Ray inspection machine, baking machine, stencil cleaning machine, etc. The company has passed ISO9001:2015 quality management system, ISO13485 medical device management system, ISO 14001 environmental management system certification, and supports the placement of 01005 components, 0.4mm Pitch BGA, QFN and other precision electronic components.